1. Home
  2. Semiconductor Equipment
  3. Wafer Manufacturing Equipment
  4. Wafer Grinding Equipment
  5. Jiangsu Jinggong Semiconductor Equipment Co., Ltd
  6. MET-5600

MET-5600

Download Datasheet Request Information

Note : Your request will be directed to Jiangsu Jinggong Semiconductor Equipment Co., Ltd.

Product Specifications

Product Details

  • Part Number
    MET-5600
  • Manufacturer
    Jiangsu Jinggong Semiconductor Equipment Co., Ltd

General Parameters

  • Net Weight
    3000 kg
  • Overall Dimensions
    2200 x 1500 x 2200 mm
  • Spindle Accuracy
    ±1 µm
  • Spindle Rotation Speed
    50000 to 160000 rpm
  • Thickness Gauge
    250 to 1000 µm
  • Wafer Size
    2 to 6 Inches, 4 to 8 Inches
  • Wheel Size
    200 mm, 202 mm
  • Note
    Grinding Station - Single Station, Dual Station

Technical Documents