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Wafer Mounting Equipment

60 Wafer Mounting Equipment for Space Applications from 15 manufacturers listed on Semiconductor Directory
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Wafer Mounting Equipment from the leading manufacturers are listed below. Use the filters to narrow down on products based on your requirement. Download datasheets and request quotes for products that you find interesting. Your inquiry will be directed to the manufacturer and their distributors in your region.

Tape Mounter Image
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Daesung Engineering Co., Ltd - Tape Mounter

Wafer Mounting Equipment from Daesung Engineering Co., Ltd
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Efficiency:
25 ea/hr
Overall Dimensions:
L x 2200 x H mm
Type:
Automatic
Wafer Size:
12 Inches
Wafer Thickness:
50 to 800 µm
more info
DFM2800 Image
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Disco Corporation - DFM2800

Wafer Mounting Equipment from Disco Corporation
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Dicing Tape Precision:
1.0 mm
Direction Precision:
0.5 Degree
Net Weight:
3100 kg
Overall Dimensions:
2150 x 2643 x 1800 mm
Positioning Accuracy:
0.5 mm
Type:
Automatic
Wafer Size:
200 mm, 300 mm
more info
MDHYM80 Image
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Guangzhou Minder-Hightech Co.,Ltd - MDHYM80

Wafer Mounting Equipment from Guangzhou Minder-Hightech Co.,Ltd
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Air Supply:
5 bar
Efficiency:
80 pcs/h
Heating Temperature:
Room Temp to 150 Degree C
Membrane Length:
100 m
Membrane Thickness:
0.05 to 0.2 mm
Membrane Type:
Blue Membrane & UV Membrane
Membrane Width:
270 to 330 mm
Net Weight:
50 kg
Overall Dimensions:
360 x 860 x 560 mm
Power Supply:
AC 220V, 10A
Type:
Manual
Wafer Size:
6 Inches, 8 Inches
Wafer Thickness:
150 to 800 µm
more info
HJC-560 Image
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HJS international - HJC-560

Wafer Mounting Equipment from HJS international
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Air Supply:
4 to 7 bar, 50 to 120 L/min
Efficiency:
2000 pcs/h
Net Weight:
800 kg
Overall Dimensions:
1300 x 1200 x 1650 mm
Positioning Accuracy:
0.01 mm
Power Supply:
AC 220V, 50 Hz, 3 kW
Rotation Axis:
0.05 Degree
Type:
Automatic
Wafer Size:
6 Inches, 8 Inches
more info
RAD-2512F/12 Image
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LINTEC Corporation Advanced Materials Operations - RAD-2512F/12

Wafer Mounting Equipment from LINTEC Corporation Advanced Materials Operations
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Air Supply:
0.6 to 0.8 Mpa, 800 L/min
Dicing Tape Precision:
D-184 from LINTEC
Efficiency:
40 wafer/h
Frame Size:
200 mm
Net Weight:
2600 kg
Overall Dimensions:
2203 x 3092 x 1800 mm
Power Supply:
Single Phase AC200-230V 10%(AC 190-253V) 50/60 HZ
Type:
Automatic
Vaccum:
>-80 kPa
Wafer Size:
200 mm, 300 mm
more info
2372-3FA Image
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N-Tec Corp - 2372-3FA

Wafer Mounting Equipment from N-Tec Corp
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Air Supply:
6 kgf/cm2
Hoop Size:
296 x 276 mm, 400 x 350 mm
Membrane Length:
400 mm
Net Weight:
4600 kg
Overall Dimensions:
3323 x 2930 x 2573 mm
Power Supply:
Single Phase 220V 60Hz
Type:
Automatic
Wafer Size:
8 Inches, 12 Inches, 212 × 216 mm
Wafer Thickness:
1.2 mm, 1.5 mm
more info
OMN-series Image
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Ohmiya Ind.Co.,Ltd - OMN-series

Wafer Mounting Equipment from Ohmiya Ind.Co.,Ltd
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Frame Size:
8 Inches, 12 Inches
Net Weight:
50 kg, 60 kg
Overall Dimensions:
540 x 840 x 420 mm, 650 x 980 x 430 mm
Type:
Manual
Wafer Size:
8 Inches, 12 Inches
more info
P-300 Image
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Powatec GmbH - P-300

Wafer Mounting Equipment from Powatec GmbH
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Frame Size:
8 Inches, 300 mm
Membrane Width:
200 to 400 mm
Net Weight:
25 kg
Overall Dimensions:
590 x 880 x 250 mm
Power Supply:
85 - 240 VAC, 115 - 230 VAC
Type:
Manual
Vaccum:
-70 kPa
Wafer Size:
up to 300 mm
Wafer Thickness:
50 µm to 4.5 mm
more info
3100 Image
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Semiconductor Equipment Corp - 3100

Wafer Mounting Equipment from Semiconductor Equipment Corp
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Air Supply:
60 psi
Net Weight:
36 kg
Overall Dimensions:
711 x 533 x 533 mm
Power Supply:
110 or 220 VAC-50/60 Hz, 3 A
Type:
Manual
Vaccum:
25 in/Hg
Wafer Size:
Up to 6 Inches
more info
TM806 Image
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Shenyang Hanway Technology Co., Ltd - TM806

Wafer Mounting Equipment from Shenyang Hanway Technology Co., Ltd
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Heating Temperature:
80 Degree C
Membrane Thickness:
0.05 to 0.2 mm
Membrane Type:
Blue Tape, UV Tape
Membrane Width:
300 mm
Net Weight:
50 kg
Overall Dimensions:
740 x 385 x 290 mm
Type:
Manual
Wafer Size:
3 to 6 Inches
Wafer Thickness:
150 to 800 µm
more info
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