Wafer Probe System

124 Wafer Probe System for Space Applications from 18 manufacturers listed on Semiconductor Directory

Wafer Probe System from the leading manufacturers are listed below. Use the filters to narrow down on products based on your requirement. Download datasheets and request quotes for products that you find interesting. Your inquiry will be directed to the manufacturer and their distributors in your region.

Theta Movement:
5 Degree
Type:
Automatic
Wafer Size:
100 mm, 120 mm, 200 mm
XY Moving Speed:
300 mm/sec
more info
Accuracy:
1 µm
Chuck Size:
325 x 400 mm
Type:
Automatic
XY Moving Speed:
250 mm/sec
Z Accuracy:
1 µm
Z Travel Area:
100 mm
more info
Chuck Size:
100 x 110 mm
Net Weight:
25 kg
Operating Temperature:
300 Degree C
Overall Dimensions:
320 x 355 x 490 mm
Stage Travel Range Fine:
6.5 x 6.5 mm
Theta Movement:
5 Degree
Type:
Manual
Wafer Size:
4 Inches
Z Travel Area:
5 mm
more info
Chuck Size:
160 mm
Resolution:
1 µm
Theta Movement:
8 Degree
Type:
Automatic
Wafer Loading:
FOUP or Magazine Wafer Loading
Wafer Size:
150 mm, 200 mm, 300 mm
Wiring Capacity:
Up to 768 single DC lines, Up to 48 RF lines
XY Moving Speed:
Up to 35 mm/sec
Z Resolution:
1 µm
Z Travel Area:
0 to 40 mm
more info
Die Size:
6 to 120 mil
Net Weight:
750 kg
Operating Temperature:
0 to 100 Degree C
Overall Dimensions:
1160 x 1240 x 1500 mm
Pad Size:
50 µm
Power Supply:
Single phase, 220VAC ±10%, 50/60Hz, 20A
Type:
Automatic
Vacuum:
-2 bar
Wafer Size:
2 Inches, 4 Inches, 6 Inches, 8 Inches
Wavelength Repeatability:
0.3 nm
more info
Magnification:
2X, 5X, 10X
Net Weight:
3000 kg
Operating Temperature:
+5 Degree C to 40 Degree C
Overall Dimensions:
1900 x 1600 x 2000 mm
Power Supply:
AC 220V±10%, 50/60 Hz, 1F, 4.4 KW
Resolution:
1.28 µm, 0.5 µm, 0.25 µm
Type:
Automatic
Wafer Size:
8 Inches
more info
Accuracy:
= 2 µm
Chuck Size:
300 mm
Net Weight:
47 kg
Operating Temperature:
-60 to 300 Degree C
Overall Dimensions:
1058 x 866 x 25 mm
Planarity:
± 5 µm
Repeatability:
< 1 µm
Resolution:
0.2 µm
Theta Movement:
3.75 Degree
Theta Stage Accuracy:
= 2 µm
Theta Stage Repeatabilty:
< 1 µm
Theta Stage Resolution:
0.2 µm
Type:
Semi Automatic, Fully Automatic
Wafer Size:
300 mm
XY Moving Speed:
50 mm/s
Z Accuracy:
= 2 µm
Z Repeatability:
< 1 µm
Z Resolution:
0.2 µm
Z Travel Area:
10 mm
more info
Chuck Size:
12 x 12 Inches
Magnification:
16 to 100X, 200X
Net Weight:
180 kg
Overall Dimensions:
1030 x 820 x 730 mm
Platen Travel Size:
50.8 mm
Power Supply:
220V, 50/60 Hz
Probe Rotation:
360 Degree
Resolution:
10 µm
Stage Travel Range Fine:
8 x 8 x 8 mm, 12 x 12 x 12 mm
Type:
Semi Automatic
Wafer Size:
12 Inches
Z Travel Area:
6 mm
more info
Chuck Size:
500 x 400 mm
Net Weight:
130 kg
Overall Dimensions:
978 x 1038 x 748 mm
Stage Travel Range Fine:
25 x 25 mm
Theta Movement:
5 Degree
Type:
Manual
Wafer Size:
300 mm
Z Travel Area:
3.5 mm+37.5 mm
more info
Chuck Flatness:
13 µm
Chuck Size:
100 x 100 mm
Net Weight:
230 kg
Overall Dimensions:
600 x 740 x 920 mm
Planarity:
12.7 µm
Platen Travel Size:
12.7 mm
Power Supply:
110 VAC, 20 A or 220 VAC, 15 A
Probe Rotation:
360 Degree
Pulse Width:
3 to 4 ns
Repeatability:
1.5 µm
Resolution:
1.5 µm
Type:
Semi Automatic
Wafer Size:
Up to 100 mm
Wavelength:
1064 nm, 532 nm, 355nm
more info