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Wafer Grinding Equipment

46 Wafer Grinding Equipment for Space Applications from 15 manufacturers listed on Semiconductor Directory
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Wafer Grinding Equipment from the leading manufacturers are listed below. Use the filters to narrow down on products based on your requirement. Download datasheets and request quotes for products that you find interesting. Your inquiry will be directed to the manufacturer and their distributors in your region.

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Axus Technology - Strasbaugh 7AF

Wafer Grinding Equipment from Axus Technology
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Compressed Air:
25 SCFM at 6.2 bar
Drain:
50.8 mm diameter
Exhaust:
750 cfm
Grinding Coolant:
D.I. water, 6 gpm (22.7 liters) at 30 psi minimum, 50 psi maximum
Maximum Speed:
1700 µm/sec
Maximum Travel:
25 mm
Minimum Movement:
0.1 µm
Net Weight:
3402 kg
Overall Dimensions:
1676 x 2133 x 1930 mm
Power Supply:
230V/208V, 3 ph, 60 Hz, 45 FLA
Rated Output:
2.2 kW
Spindle Coolant:
Municipal or chilled water - 1 gpm (3.78 liters) at 30 psi minimum, 80 psi maximum
Spindle Rotation Speed:
500 to 4500 rpm
Thickness Gauge:
0 to 25000-micron
Traversing Spindles:
10”/sec (254 mm)
Vacuum:
5 cfm at 25 Inches Hg
Wafer Size:
200 mm
Wheel Size:
280 mm
more info
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Beijing TSD Semiconductor Co., Ltd - TFG-2200

Wafer Grinding Equipment from Beijing TSD Semiconductor Co., Ltd
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Rated Output:
6 kW
Wafer Size:
6 Inches, 8 Inches
Wheel Size:
203 (OD) mm
more info
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Disco Corporation - DAG810

Wafer Grinding Equipment from Disco Corporation
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Grinding Method:
Anomalous In-Feed Grinding
Net Weight:
1300 kg
Overall Dimensions:
600 x 1700 x 1780 mm
Rated Output:
4.2 kW
Spindle Rated Torque:
5.9 Nm
Spindle Rotation Speed:
1000 to 7000 rpm
Wafer Size:
8 Inches
Wheel Size:
200 mm
more info
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Engis Corporation - EAG-28SAND

Wafer Grinding Equipment from Engis Corporation
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Automatic Dressing System:
400 rpm/ 200W/ 90 x 30 mm
Automatic Measuring System:
1 Probe, 5 mm (max Height)
Minimum Feed Speed:
0.1 µm/sec +
Net Weight:
3900 kg
Overall Dimensions:
2200 x 1800 x 2300 mm
Rated Output:
9.5 kW, 1.5 kW
Resolution:
0.1 µm
Spindle Rotation Speed:
4000 rpm
Wafer Size:
200 mm, 300 mm
Wheel Size:
303 mm
Work Table Spindle:
260 rpm
more info
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Grintimate Precision Co., Ltd - GTR-1215

Wafer Grinding Equipment from Grintimate Precision Co., Ltd
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Minimum Feed Speed:
0.1 µm/sec +
Net Weight:
3200 kg
Overall Dimensions:
1872 x 1215 x 2380 mm
Spindle Accuracy:
0.001 mm
Spindle Rotation Speed:
0 to 3000 rpm
Vacuum:
4 to 12 mm
Wafer Size:
4 to 12 Inches
Wheel Size:
304 mm
Work Table Spindle:
5 to 300 rpm
more info
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Joen Lih Machinery Co., Ltd - JL-200SCG

Wafer Grinding Equipment from Joen Lih Machinery Co., Ltd
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Maximum Speed:
300 mm/min
Net Weight:
2000 kg
Overall Dimensions:
600 x 1700 x 2100 mm
Rated Output:
3.7 kW
Resolution:
0.1 µm
Spindle Rotation Speed:
1000 to 5000 rpm
Surface Roughness:
Ra 0.02 µm
Wafer Size:
200 mm
Wheel Size:
250 mm
Work Table Spindle:
0 to 500 rpm
more info
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Komatsu (Dalian) Machine Tool Corp - GCG300

Wafer Grinding Equipment from Komatsu (Dalian) Machine Tool Corp
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Overall Dimensions:
2370 x 3500 x 2500 mm
Spindle Rotation Speed:
600 to 3000 rpm
Wafer Size:
300 mm
Wheel Size:
120 mm
Work Table Spindle:
0 to 450 rpm
more info
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Lapmaster Wolters GmbH - AC microLine 700 F

Wafer Grinding Equipment from Lapmaster Wolters GmbH
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Center Drive Speed:
83 rpm
Max Load Pressure:
1000 daN, 1800 daN
Net Weight:
4000 kg
Overall Dimensions:
2200 x 1900 x 1900 mm
Rated Output:
2.5 kW
Spindle Rotation Speed:
300 rpm, 420 rpm
Thickness Gauge:
75 mm
Upper Lower Drive Power:
24 kW, 36 kW
Wafer Size:
200 mm
Wheel Size:
720 mm
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Logomatic GmbH - Q2

Wafer Grinding Equipment from Logomatic GmbH
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Net Weight:
4082 kg
Overall Dimensions:
1600 x 1600 x 1900 mm
Power Supply:
15 kW
Wafer Size:
6 Inches, 8 Inches
more info
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Micro Engineering Inc - CMG-802XJ

Wafer Grinding Equipment from Micro Engineering Inc
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Thickness Gauge:
30 µm
Wafer Size:
8 Inches, 12 Inches
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