1. Home
  2. Semiconductor Equipment
  3. Wafer Manufacturing Equipment
  4. Wafer Grinding Equipment
  5. Revasum
  6. 7AF-HMG

7AF-HMG

Wafer Grinding Equipment by Revasum
Download Datasheet Request Information

Note : Your request will be directed to Revasum.

Product Specifications

Product Details

  • Part Number
    7AF-HMG
  • Manufacturer
    Revasum

General Parameters

  • Net Weight
    3865 kg
  • Overall Dimensions
    1860 x 2150 x 2460 mm
  • Spindle Accuracy
    1 µm
  • Spindle Rotation Speed
    500 to 4300 rpm
  • Surface Roughness
    200 Å to 30 Å
  • Wafer Size
    50 to 200 mm
  • Work Table Spindle
    20 to 700 rpm

Technical Documents