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WB-200AG

Wafer Laser Marking Machine by E&R Engineering Corporation (3 more products)
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Product Specifications

Product Details

  • Part Number
    WB-200AG
  • Manufacturer
    E&R Engineering Corporation

General Parameters

  • Loading Stations
    Foup x 2 + FFC Cassette x 1
  • Marking Accuracy
    ±50 µm
  • Marking Repeatability
    ±25 µm
  • Thickness
    ±150 µm
  • Throughput
    500 CPS
  • Wafer Size
    6 inches, 8 inches

Technical Documents