DFM2800

Wafer Mounting Equipment by Disco Corporation

Note : Your request will be directed to Disco Corporation.

DFM2800 Image

Product Specifications

Product Details

  • Part Number
    DFM2800
  • Manufacturer
    Disco Corporation

General Parameters

  • Dicing Tape Precision
    1.0 mm
  • Direction Precision
    0.5 Degree
  • Net Weight
    3100 kg
  • Overall Dimensions
    2150 x 2643 x 1800 mm
  • Positioning Accuracy
    0.5 mm
  • Type
    Automatic
  • Wafer Size
    200 mm, 300 mm

Technical Documents