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AX8300S

Wafer X-Ray Inspection Machine by Shenzhen Unicomp Technology Co., Ltd (4 more products)
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Product Specifications

Product Details

  • Part Number
    AX8300S
  • Manufacturer
    Shenzhen Unicomp Technology Co., Ltd

General Parameters

  • Detector
    FPD
  • Detector Angle
    360 Degree
  • Frame Rate
    10 fps
  • Image Acquisition
    2D, 2.5D, 3D
  • Magnification
    200X
  • Max Inspection Area
    410 x 450 mm
  • Max Load Area
    570 mm
  • Net Weight
    2900 kg
  • Overall Dimensions
    1550 x 1770 x 1825 mm
  • Pixel Matrix
    2532 x 2944 pixel
  • Pixel Size
    49.5 µm
  • Power Supply
    AC220, 50 Hz, 3.5 kW
  • Resolution
    2 µm
  • Tube Current
    250 µA
  • Tube Type
    Sealed
  • Tube Voltage
    110 kV
  • X Ray Leakage
    1 µSv/h

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