HW812

Die Bonder by HIGHLYWIN (1 more product)

Note : Your request will be directed to HIGHLYWIN.

HW812 Image

Product Specifications

Product Details

  • Part Number
    HW812
  • Manufacturer
    HIGHLYWIN

General Parameters

  • Bonding Method
    Die Bonder
  • Chip Size
    0.381 x 0.381 mm to 5.08 x 5.08 mm
  • Compressed Air
    0.5 Mpa
  • Power Supply
    AC 220V 50 Hz
  • Type
    Automatic
  • Wafer Die attach Placement Speed
    17000 UPH
  • Wafer Size
    12 Inches
  • X Y Placement Accuracy
    20 µm

Technical Documents