1. Home
  2. Semiconductor Equipment
  3. Assembly & Packaging Equipment
  4. Die Bonders
  5. E-Globaledge Corporation
  6. DBD4200R

DBD4200R

Die Bonder by E-Globaledge Corporation
Download Datasheet Request Information

Note : Your request will be directed to E-Globaledge Corporation.

DBD4200R Image

Product Specifications

Product Details

  • Part Number
    DBD4200R
  • Manufacturer
    E-Globaledge Corporation

General Parameters

  • Bond Force
    19.6 to 122 cN
  • Bonding Cycle Time
    0.15 sec/chip
  • Bonding Method
    Die Bonder
  • Bonding Tool Setting Temperature
    500 Degree C
  • Chip Size
    0.25 to 0.80 mm
  • Compressed Air
    0.4 MPa
  • Net Weight
    750 kg
  • Overall Dimensions
    1100 x 1100 x 1880 mm
  • Power Supply
    200 VAC, 50/60 Hz
  • Type
    Automatic
  • Wafer Die Attach Size
    20 to 60 mm
  • Wafer Size
    6 Inches, 8 Inches
  • X Y Placement Accuracy
    ±50 µm
  • Note
    Head operating range:- x=4mm y=56mm max

Technical Documents
View similar products