PECVD

Thin Film Deposition Equipment by Syskey Technology Co., Ltd (4 more products)

Note : Your request will be directed to Syskey Technology Co., Ltd.

PECVD Image

Product Specifications

Product Details

  • Part Number
    PECVD
  • Manufacturer
    Syskey Technology Co., Ltd

General Parameters

  • CVD Processes
    SiOx, SiNx, a-Si, DLC
  • Integration
    Load-Lock, Glove Box
  • Temperature Range
    Up to 400 Degree C
  • Thin Film Uniformity
    ±3%
  • Type
    CVD Process
  • Uniform Gas
    Up to 10 Gas Lines
  • Wafer Size
    Up to 12 Inches

Technical Documents