FPD-PECVD

Thin Film Deposition Equipment by Syskey Technology Co., Ltd (4 more products)

Note : Your request will be directed to Syskey Technology Co., Ltd.

FPD-PECVD Image

Product Specifications

Product Details

  • Part Number
    FPD-PECVD
  • Manufacturer
    Syskey Technology Co., Ltd

General Parameters

  • CVD Processes
    a-Si, SiNx, SiOx
  • Temperature Range
    380 Degree C
  • Thin Film Uniformity
    ±3%
  • Type
    CVD Process
  • Uniform Gas
    Up to six 7 gas lines
  • Wafer Size
    Up to 550 x 650 mm2

Technical Documents