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X7056-II BO

Wafer Automated Optical Inspection (AOI) Equipment by Viscom AG (1 more product)
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Product Specifications

Product Details

  • Part Number
    X7056-II BO
  • Manufacturer
    Viscom AG

General Parameters

  • Air Supply
    4 to 8 bar
  • Bottom Clearance
    50 mm
  • Camera
    1 MP
  • Conveyor Height
    860 to 980 ± 20 mm
  • Field of View
    23 x 23 mm
  • Net Weight
    2245 kg
  • Overall Dimensions
    1493 x 1631 x 2251 mm
  • Power Supply
    400 V, 3P/N/PE
  • Resolution
    4.5 µm
  • Top Clearance
    Up to 25 mm
  • Top Edge Clearance
    3 mm
  • Type
    Wafer Wire Bond Inspection
  • Wafer Size
    Up to 450 x 350 mm

Technical Documents
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