CMG-802XJ

Wafer Grinding Equipment by Micro Engineering Inc

Note : Your request will be directed to Micro Engineering Inc.

Product Specifications

Product Details

  • Part Number
    CMG-802XJ
  • Manufacturer
    Micro Engineering Inc

General Parameters

  • Thickness Gauge
    30 µm
  • Wafer Size
    8 Inches, 12 Inches

Technical Documents