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WID-200

Wafer Laser Marking Machine by E&R Engineering Corporation (3 more products)
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WID-200 Image

Product Specifications

Product Details

  • Part Number
    WID-200
  • Manufacturer
    E&R Engineering Corporation

General Parameters

  • Loading Stations
    Open cassette x 3
  • Marking Accuracy
    ±100 µm
  • Marking Repeatability
    ±25 µm
  • Thickness
    250 m
  • Throughput
    160 wph
  • Wafer Size
    6 inches, 8 inches

Technical Documents