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AX8300Si

Wafer X-Ray Inspection Machine by Shenzhen Unicomp Technology Co., Ltd (4 more products)
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Product Specifications

Product Details

  • Part Number
    AX8300Si
  • Manufacturer
    Shenzhen Unicomp Technology Co., Ltd

General Parameters

  • Detector
    FPD
  • Focus Spot Size
    2 µm
  • Frame Rate
    37 fps
  • Image Acquisition
    3D
  • Max Inspection Area
    270 x 100 mm
  • Max Load Area
    310 x 110 mm
  • Max Tube Power
    6.5 kW
  • Net Weight
    2700 kg
  • Overall Dimensions
    2200 x 1250 x 1960 mm
  • Pixel Matrix
    2352 x 294 pixel
  • Pixel Size
    49.5 µm
  • Power Supply
    AC 110-220V, 50/60 Hz, 6.5 kW
  • Resolution
    2 µm
  • Tube Current
    200 µA
  • Tube Type
    Sealed
  • Tube Voltage
    40 to 110 kV
  • X Ray Leakage
    1 µSv/h

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