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Ultrasonic Wire Bonding Machine

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Ultrasonic Wire Bonding Machine Image

Product Specifications

Product Details

  • Part Number
    Ultrasonic Wire Bonding Machine
  • Manufacturer
    Guangdong Xiaowei Intelligent Technology Co., Ltd

General Parameters

  • Bond Froce
    10 to 60 g
  • Bond Time
    5 to 200 ms
  • Bonding Area
    160 mm
  • Bonding Method
    Wire bonder
  • Net Weight
    36 kg
  • Overall Dimensions
    600 x 560 x 390 mm
  • Power Supply
    AC 220V±10% (50Hz), 60W
  • Ultrasonic Power
    0 to 5 W
  • Ultrasonic Frequency
    61 KHz±1 KHz
  • Wire Feed Angle
    45 Degree

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