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125 Die Bonders for Space Applications from 31 manufacturers listed on Semiconductor Directory
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Die Bonders from the leading manufacturers are listed below. Use the filters to narrow down on products based on your requirement. Download datasheets and request quotes for products that you find interesting. Your inquiry will be directed to the manufacturer and their distributors in your region.

PALOMAR 3880-II Image
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Palomar Technologies, Inc - PALOMAR 3880-II

Die Bonder from Palomar Technologies, Inc
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Bonding Method:
Die Bonder
Compressed Air:
4 bar
Net Weight:
1134 kg
Overall Dimensions:
1560 x 1510 x 1770 mm
Power Supply:
230 VAC, 50/60 Hz, 10A, Single Phase
Repeatability:
3.5 µm
Substrate Working Range:
914.4 x 508 mm
Theta Placement Accuracy:
> 400 Degree
Type:
Automatic
Wafer Die attach Placement Speed:
1200 UPH
X Y Placement Accuracy:
< 5 µm
more info
Clip Attach Image
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3S Silicon Tech., Inc - Clip Attach

Die Bonder from 3S Silicon Tech., Inc
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Bonding Cycle Time:
1.2 to 1.5 sec/cycle (1-40 ea.chip)
Bonding Method:
Clip Die Bonder
Type:
Automatic
X Y Placement Accuracy:
=50 µm
more info
FC-1210 Image
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4JMSolutions Ltd - FC-1210

Die Bonder from 4JMSolutions Ltd
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Bonding Method:
Die Bonder
Type:
Automatic
Wafer Die attach Placement Speed:
Up to 5500 SUPH
Wafer Die Attach Size:
0.5 to 6 mm, 6 to 20 mm
X Y Placement Accuracy:
± 3 µm, ± 5 µm
more info
AT-DB-1 Image
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Advanced Techniques US Inc. (ATCO) - AT-DB-1

Die Bonder from Advanced Techniques US Inc. (ATCO)
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Bond Force:
Up to 300 N
Bonding Method:
Die Bonder, Flip Chip Bonder
Compressed Air:
6.5 to 8.2 bar
Net Weight:
101 kg
Overall Dimensions:
915 x 457 x 1118 mm
Power Supply:
208-240 VAC 25A, 1 Phase, 50/60 Hz
Substrate Thickness:
8 mm
Substrate Working Range:
305 x 355 mm
Type:
Semi Automatic
Wafer Die Attach Size:
25 mm
X Y Placement Accuracy:
± 5 µm
more info
AB-1000 Image
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Airihatsu Automation Equipment Co., Ltd - AB-1000

Die Bonder from Airihatsu Automation Equipment Co., Ltd
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Bond Force:
0.2 to 1 N
Bonding Method:
Die Bonder
Chip Size:
0.15 to 1 mm
Net Weight:
2100 kg
Overall Dimensions:
1600 x 1920 x 1700 mm
Type:
Automatic
Wafer Chip Thickness:
0.015 mm
Wafer Die Attach Size:
2.5 mm
Wafer Size:
8 Inches, 12 Inches
X Y Placement Accuracy:
± 5 µm
more info
ASCD750 Image
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Akim Corporation - ASCD750

Die Bonder from Akim Corporation
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Bonding Cycle Time:
1.2 sec/pc
Bonding Method:
Die Bonder
Overall Dimensions:
1150 x 1250 x 1700 mm
Type:
Automatic
Wafer Size:
6 Inches
more info
AFC Plus Image
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ASMPT SEMI USA, Inc - AFC Plus

Die Bonder from ASMPT SEMI USA, Inc
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Bond Force:
3 g up to 2000 g
Bonding Cycle Time:
< 15 sec
Bonding Method:
Die Bonder, Flip Chip Bonder
Compressed Air:
5.5 bar
Net Weight:
2000 kg
Overall Dimensions:
1690 x 1430 x 2040 mm
Power Supply:
400 V
Standard Bond Head:
360 Degree
Substrate Working Range:
Very Small Submounts to 300 mm
Type:
Automatic
Wafer Size:
300 x 300 mm
X Y Placement Accuracy:
± 1 µm
more info
Datacon 2200 evo Image
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BE Semiconductor Industries N.V. - Datacon 2200 evo

Die Bonder from BE Semiconductor Industries N.V.
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Bond Force:
0.5 to 75 N programmable
Bond Head:
4 Heads
Bonding Method:
Die Bonder
Chip Trays Waffle Pack:
51 x 51 mm, 102 x 102 mm
Frame Size:
FF070, FF105, FF108, FF123
Heated Bond Head:
Up to 450 Degree C
Net Weight:
1300 kg
Overall Dimensions:
1160 x 1225 x 1750 mm
Standard Bond Head:
0 Degree to 360 Degree rotation
Substrate Working Range:
325 x 200 mm
Theta Placement Accuracy:
± 0.15 Degree
Type:
Automatic
Wafer Die attach Placement Speed:
Up to 7000 UPH
Wafer Die Attach Size:
0.17 to 50 mm
Wafer Die Thickness:
>50 µm
Wafer Flip Chip Placement Speed:
Up to 2500 UPH/module
Wafer Flip Chip Size:
0.5 to 50 mm
Wafer Flip Chip Without Dipping Placement Speed:
Up to 3200 UPH/module
Wafer Size:
2 to 12 Inches
X Y Placement Accuracy:
± 10 µm
more info
DU9721 Image
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BOZHON Precision Industry Technology Co., Ltd - DU9721

Die Bonder from BOZHON Precision Industry Technology Co., Ltd
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Bond Force:
20 to 500 g
Bonding Method:
Die Bonder
Type:
Automatic
Wafer Size:
12 Inches
X Y Placement Accuracy:
± 7 µm
more info
BESTEM-C310 Image
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Canon Machinery Inc - BESTEM-C310

Die Bonder from Canon Machinery Inc
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Bonding Cycle Time:
1.2 sec/cycle
Bonding Method:
Clip Bonder
Clip Hoop Frame:
9 to 60 mm
Compressed Air:
0.4 MPa (60L/min)
Frame Size:
300 x 100 mm
Net Weight:
1400 kg
Overall Dimensions:
2557 x 1473 x 2045 mm
Power Supply:
AC 200 V 30 A
Substrate Thickness:
0.075 to 0.6 mm
Type:
Automatic
Wafer Die Attach Size:
0.8 to 10 mm
Wafer Die Thickness:
0.1 to 1 mm
X Y Placement Accuracy:
± 68 µm
more info
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