Note : Your request will be directed to BOZHON Precision Industry Technology Co., Ltd.

DU9721 Image

Product Specifications

Product Details

  • Part Number
    DU9721
  • Manufacturer
    BOZHON Precision Industry Technology Co., Ltd

General Parameters

  • Bond Force
    20 to 500 g
  • Bonding Method
    Die Bonder
  • Type
    Automatic
  • Wafer Size
    12 Inches
  • X Y Placement Accuracy
    ± 7 µm

Technical Documents