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AT-DB-1

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Product Specifications

Product Details

  • Part Number
    AT-DB-1
  • Manufacturer
    Advanced Techniques US Inc. (ATCO)

General Parameters

  • Bond Force
    Up to 300 N
  • Bonding Method
    Die Bonder, Flip Chip Bonder
  • Compressed Air
    6.5 to 8.2 bar
  • Net Weight
    101 kg
  • Overall Dimensions
    915 x 457 x 1118 mm
  • Power Supply
    208-240 VAC 25A, 1 Phase, 50/60 Hz
  • Substrate Thickness
    8 mm
  • Substrate Working Range
    305 x 355 mm
  • Type
    Semi Automatic
  • Wafer Die Attach Size
    25 mm
  • X Y Placement Accuracy
    ± 5 µm

Technical Documents
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