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AB-1000

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Product Specifications

Product Details

  • Part Number
    AB-1000
  • Manufacturer
    Airihatsu Automation Equipment Co., Ltd

General Parameters

  • Bond Force
    0.2 to 1 N
  • Bonding Method
    Die Bonder
  • Chip Size
    0.15 to 1 mm
  • Net Weight
    2100 kg
  • Overall Dimensions
    1600 x 1920 x 1700 mm
  • Type
    Automatic
  • Wafer Chip Thickness
    0.015 mm
  • Wafer Die Attach Size
    2.5 mm
  • Wafer Size
    8 Inches, 12 Inches
  • X Y Placement Accuracy
    ± 5 µm

Technical Documents
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