AFC Plus

Note : Your request will be directed to ASMPT SEMI USA, Inc.

AFC Plus Image

Product Specifications

Product Details

  • Part Number
    AFC Plus
  • Manufacturer
    ASMPT SEMI USA, Inc

General Parameters

  • Bond Force
    3 g up to 2000 g
  • Bonding Cycle Time
    < 15 sec
  • Bonding Method
    Die Bonder, Flip Chip Bonder
  • Compressed Air
    5.5 bar
  • Net Weight
    2000 kg
  • Overall Dimensions
    1690 x 1430 x 2040 mm
  • Power Supply
    400 V
  • Standard Bond Head
    360 Degree
  • Substrate Working Range
    Very Small Submounts to 300 mm
  • Type
    Automatic
  • Wafer Size
    300 x 300 mm
  • X Y Placement Accuracy
    ± 1 µm

Technical Documents