1. Home
  2. Semiconductor Equipment
  3. Assembly & Packaging Equipment
  4. Die Bonders
  5. Canon Machinery Inc
  6. BESTEM-C310

BESTEM-C310

Download Datasheet Request Information

Note : Your request will be directed to Canon Machinery Inc.

BESTEM-C310 Image

Product Specifications

Product Details

  • Part Number
    BESTEM-C310
  • Manufacturer
    Canon Machinery Inc

General Parameters

  • Bonding Cycle Time
    1.2 sec/cycle
  • Bonding Method
    Clip Bonder
  • Clip Hoop Frame
    9 to 60 mm
  • Compressed Air
    0.4 MPa (60L/min)
  • Frame Size
    300 x 100 mm
  • Net Weight
    1400 kg
  • Overall Dimensions
    2557 x 1473 x 2045 mm
  • Power Supply
    AC 200 V 30 A
  • Substrate Thickness
    0.075 to 0.6 mm
  • Type
    Automatic
  • Wafer Die Attach Size
    0.8 to 10 mm
  • Wafer Die Thickness
    0.1 to 1 mm
  • X Y Placement Accuracy
    ± 68 µm

Technical Documents
View similar products