ASCD750

Die Bonder by Akim Corporation

Note : Your request will be directed to Akim Corporation.

ASCD750 Image

Product Specifications

Product Details

  • Part Number
    ASCD750
  • Manufacturer
    Akim Corporation

General Parameters

  • Bonding Cycle Time
    1.2 sec/pc
  • Bonding Method
    Die Bonder
  • Overall Dimensions
    1150 x 1250 x 1700 mm
  • Type
    Automatic
  • Wafer Size
    6 Inches

Technical Documents