FC-1210

Note : Your request will be directed to 4JMSolutions Ltd.

FC-1210 Image

Product Specifications

Product Details

  • Part Number
    FC-1210
  • Manufacturer
    4JMSolutions Ltd

General Parameters

  • Bonding Method
    Die Bonder
  • Type
    Automatic
  • Wafer Die attach Placement Speed
    Up to 5500 SUPH
  • Wafer Die Attach Size
    0.5 to 6 mm, 6 to 20 mm
  • X Y Placement Accuracy
    ± 3 µm, ± 5 µm

Technical Documents