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PALOMAR 3880-II

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Product Specifications

Product Details

  • Part Number
    PALOMAR 3880-II
  • Manufacturer
    Palomar Technologies, Inc

General Parameters

  • Bonding Method
    Die Bonder
  • Compressed Air
    4 bar
  • Net Weight
    1134 kg
  • Overall Dimensions
    1560 x 1510 x 1770 mm
  • Power Supply
    230 VAC, 50/60 Hz, 10A, Single Phase
  • Repeatability
    3.5 µm
  • Substrate Working Range
    914.4 x 508 mm
  • Theta Placement Accuracy
    > 400 Degree
  • Type
    Automatic
  • Wafer Die attach Placement Speed
    1200 UPH
  • X Y Placement Accuracy
    < 5 µm

Technical Documents
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