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Wafer Mounting Equipment - Page 5

60 Wafer Mounting Equipment from 15 Manufacturers meet your specification.
V-300H Image
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Powatec GmbH - V-300H

Wafer Mounting Equipment from Powatec GmbH
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Air Supply:
4 to 6 bar
Efficiency:
80 to 100 sec per mount
Frame Size:
up to 300 mm
Heating Temperature:
up to 90 Degree C
Net Weight:
65 kg
Overall Dimensions:
505 x 1100 x 785 mm
Power Supply:
85-240 VAC, 50/60 Hz, 25 W
Type:
Semi Automatic
Vaccum:
2 mbar absolute, Festo PUN-8, Ø8 mm
Wafer Size:
up to 300 mm
Wafer Thickness:
80 µm to 3 mm
more info
3100 Image
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Semiconductor Equipment Corp - 3100

Wafer Mounting Equipment from Semiconductor Equipment Corp
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Air Supply:
60 psi
Net Weight:
36 kg
Overall Dimensions:
711 x 533 x 533 mm
Power Supply:
110 or 220 VAC-50/60 Hz, 3 A
Type:
Manual
Vaccum:
25 in/Hg
Wafer Size:
Up to 6 Inches
more info
3150 Image
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Semiconductor Equipment Corp - 3150

Wafer Mounting Equipment from Semiconductor Equipment Corp
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Air Supply:
60 psi
Net Weight:
45 kg
Overall Dimensions:
813 x 584 x 635 mm
Power Supply:
110 or 220 VAC-50/60 Hz, 3 A
Type:
Manual
Vaccum:
25 in/Hg
Wafer Size:
Up to 8 Inches
more info
300 Image
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Semiconductor Equipment Corp - 300

Wafer Mounting Equipment from Semiconductor Equipment Corp
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Air Supply:
60 psi
Net Weight:
54 kg
Overall Dimensions:
1016 x 635 x 635 mm
Power Supply:
110 or 220 VAC-50/60 Hz, 3 A
Type:
Manual
Vaccum:
25 in/Hg
Wafer Size:
Up to 12 Inches
more info
TM806 Image
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Shenyang Hanway Technology Co., Ltd - TM806

Wafer Mounting Equipment from Shenyang Hanway Technology Co., Ltd
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Heating Temperature:
80 Degree C
Membrane Thickness:
0.05 to 0.2 mm
Membrane Type:
Blue Tape, UV Tape
Membrane Width:
300 mm
Net Weight:
50 kg
Overall Dimensions:
740 x 385 x 290 mm
Type:
Manual
Wafer Size:
3 to 6 Inches
Wafer Thickness:
150 to 800 µm
more info
TM808 Image
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Shenyang Hanway Technology Co., Ltd - TM808

Wafer Mounting Equipment from Shenyang Hanway Technology Co., Ltd
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Heating Temperature:
80 Degree C
Membrane Thickness:
0.05 to 0.2 mm
Membrane Type:
Blue Tape, UV Tape
Membrane Width:
300 mm
Net Weight:
55 kg
Overall Dimensions:
820 x 410 x 350 mm
Type:
Manual
Wafer Size:
3 to 8 Inches
Wafer Thickness:
150 to 800 µm
more info
DSXUV-Wafer-M6 Image
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Shenzhen Deshengxing Electronics Co., Ltd - DSXUV-Wafer-M6

Wafer Mounting Equipment from Shenzhen Deshengxing Electronics Co., Ltd
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Air Supply:
5 to 8 bar
Frame Size:
6 Inches
Heating Temperature:
Indoor Temp to 65 Degree C
Membrane Thickness:
0.05 to 0.25 mm
Net Weight:
60 kg
Overall Dimensions:
875 x 450 x 317 mm
Power Supply:
AC 220V
Type:
Semi Automatic
Wafer Size:
6 Inches
Wafer Thickness:
500 µm, 100 µm
more info
DSXUV-TapeM-8 Image
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Shenzhen Deshengxing Electronics Co., Ltd - DSXUV-TapeM-8

Wafer Mounting Equipment from Shenzhen Deshengxing Electronics Co., Ltd
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Air Supply:
5 to 8 bar
Frame Size:
6 Inches
Heating Temperature:
Indoor Temp to 65 Degree C
Membrane Thickness:
0.05 to 0.25 mm
Net Weight:
60 kg
Overall Dimensions:
875 x 450 x 317 mm
Power Supply:
AC 220V
Type:
Manual
Wafer Size:
6 Inches
Wafer Thickness:
500 µm, 100 µm
more info
FM150 Image
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Shenzhen Deshengxing Electronics Co., Ltd - FM150

Wafer Mounting Equipment from Shenzhen Deshengxing Electronics Co., Ltd
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Air Supply:
5 to 8 bar
Component Replacement Time:
10 min
Frame Size:
152 mm
Heating Temperature:
Indoor Temp to 65 Degree C
Overall Dimensions:
850 x 390 x 400 mm
Power Supply:
AC 220V 50/60 Hz
Type:
Manual
Wafer Size:
3 to 6 Inches
Wafer Thickness:
150 µm, 100 µm
more info
FM200 Image
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Shenzhen Deshengxing Electronics Co., Ltd - FM200

Wafer Mounting Equipment from Shenzhen Deshengxing Electronics Co., Ltd
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Air Supply:
5 to 8 bar
Component Replacement Time:
10 min
Frame Size:
152 mm, 203 mm
Heating Temperature:
Indoor Temp to 65 Degree C
Overall Dimensions:
900 x 450 x 400 mm
Power Supply:
AC 220V 50/60 Hz
Type:
Manual
Wafer Size:
3 to 8 Inches
Wafer Thickness:
150 µm, 100 µm
more info
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