1. Home
  2. Semiconductor Equipment
  3. Assembly & Packaging Equipment
  4. Die Bonders
  5. HIGHLYWIN
  6. HWS100-N

HWS100-N

Die Bonder by HIGHLYWIN (1 more product)
Download Datasheet Request Information

Note : Your request will be directed to HIGHLYWIN.

HWS100-N Image

Product Specifications

Product Details

  • Part Number
    HWS100-N
  • Manufacturer
    HIGHLYWIN

General Parameters

  • Bonding Cycle Time
    65 ms
  • Bonding Method
    Die Bonder
  • Chip Size
    0.0762 x 0.0762 mm to 20.32 x 2.032 mm
  • Compressed Air
    0.5 Mpa 40 L/min
  • Power Supply
    AC 220V 50 Hz, 1.6 KW
  • Type
    Automatic
  • Wafer Size
    6 Inches
  • X Y Placement Accuracy
    ±1 mil

Technical Documents
View similar products