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Thermal ALD

Thin Film Deposition Equipment by Syskey Technology Co., Ltd (4 more products)
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Product Specifications

Product Details

  • Part Number
    Thermal ALD
  • Manufacturer
    Syskey Technology Co., Ltd

General Parameters

  • ALD Processes
    Al2O3, HfO2, SiO2, TiO2, Ta2O5, ZnO, AZO, HfO2, SiO2, TiO2, GaO2, AlN, SiN
  • Response Time
    10 msec
  • Temperature Range
    Up to 400 Degree C (Thermal, Plasma)
  • Thin Film Uniformity
    ±1%
  • Type
    ALD Process
  • Wafer Size
    Up to 300 mm

Technical Documents
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