WI300

Wafer Automated Optical Inspection (AOI) Equipment by Micro Modular System Sdn. Bhd

Note : Your request will be directed to Micro Modular System Sdn. Bhd.

WI300 Image

Product Specifications

Product Details

  • Part Number
    WI300
  • Manufacturer
    Micro Modular System Sdn. Bhd

General Parameters

  • Accuracy
    0.25 mm
  • Camera
    65 MP
  • Field of View
    14.9 x 11.2 mm
  • Inspection Speed
    10000 uph, 20000 uph
  • Magnification
    2X
  • Overall Dimensions
    1250 x 2400 x 2050 mm
  • Type
    Wafer Wire Bond Inspection
  • Wafer Size
    4 to 6 Inches

Technical Documents