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S6053BO-V

Wafer Automated Optical Inspection (AOI) Equipment by Viscom AG (1 more product)
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Product Specifications

Product Details

  • Part Number
    S6053BO-V
  • Manufacturer
    Viscom AG

General Parameters

  • Air Supply
    4 to 6 bar
  • Bonding Type
    Ball bond, wedge bond, wire, die/SMD, ribbon
  • Conveyor Height
    860 to 1180 ± 20 mm
  • Inspection Speed
    1000 wire bond connections/min
  • Net Weight
    800 kg
  • Overall Dimensions
    1000 x 1615 x 1055 mm
  • Power Supply
    400 V, 3P/N/PE
  • Resolution
    Up to 2.5 µm
  • Top Clearance
    Up to 35 mm
  • Type
    Wafer Wire Bond Inspection
  • Wafer Size
    280 x 300 mm, 280 x 130 mm, 210 x 130 mm

Technical Documents
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