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SEC-200

Wafer Etching System by Boffotto (Hong Kong) Limited
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Product Specifications

Product Details

  • Part Number
    SEC-200
  • Manufacturer
    Boffotto (Hong Kong) Limited

General Parameters

  • Applications
    Dielectric Etching
  • Etching Speed
    600 to 5000 A/min
  • Process Type
    Dry Etching
  • Substrates
    Si, P oly, SiC, GaN, Nitride, Oxide
  • Wafer Size
    4 Inches, 6 Inches, 12 Inches

Technical Documents