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Automatic Etching System

Wafer Etching System by Japan Create Co.,Ltd (3 more products)
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Automatic Etching System Image

Product Specifications

Product Details

  • Part Number
    Automatic Etching System
  • Manufacturer
    Japan Create Co.,Ltd

General Parameters

  • Process Type
    Dry Etching
  • Rotation Speed
    3000 rpm
  • Wafer Size
    300 mm

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