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NM-EFE3AA-D

Wafer Etching System by Panasonic Corporation (1 more product)
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Product Specifications

Product Details

  • Part Number
    NM-EFE3AA-D
  • Manufacturer
    Panasonic Corporation

General Parameters

  • Air Supply
    5 to 7 bar, 250 L/min
  • Applications
    Plamsa Etching
  • Gases Control
    4 gas Lines
  • N2 Consumption
    1 to 2 bar, 50 L/min
  • Net Weight
    2000 kg
  • Overall Dimensions
    1375 x 2600 x 2000 mm
  • Power Supply
    3 Phase AC 200-240V, ±10, 50/60 Hz, 21.00 kVA
  • Process Type
    Dry Etching
  • Substrates
    Silicon
  • Wafer Size
    100 mm, 150 mm, 200 mm

Technical Documents