BATCHSPRAY

Wafer Etching System by Siconnex Customized Solutions GmbH

Note : Your request will be directed to Siconnex Customized Solutions GmbH.

BATCHSPRAY Image

Product Specifications

Product Details

  • Part Number
    BATCHSPRAY
  • Manufacturer
    Siconnex Customized Solutions GmbH

General Parameters

  • Footprint
    12 m²
  • Number Of Chambers
    up to 2
  • Process Type
    Wet Etching
  • Substrates
    SiC, GaN, Si, GaAs, Ge
  • Throughput
    Up to 300 wph
  • Uniformity
    1%
  • Wafer Size
    200 mm, 300 mm

Technical Documents