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EAG-28SAND

Wafer Grinding Equipment by Engis Corporation (2 more products)
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Product Specifications

Product Details

  • Part Number
    EAG-28SAND
  • Manufacturer
    Engis Corporation

General Parameters

  • Automatic Dressing System
    400 rpm/ 200W/ 90 x 30 mm
  • Automatic Measuring System
    1 Probe, 5 mm (max Height)
  • Minimum Feed Speed
    0.1 µm/sec +
  • Net Weight
    3900 kg
  • Overall Dimensions
    2200 x 1800 x 2300 mm
  • Rated Output
    9.5 kW, 1.5 kW
  • Resolution
    0.1 µm
  • Spindle Rotation Speed
    4000 rpm
  • Wafer Size
    200 mm, 300 mm
  • Wheel Size
    303 mm
  • Work Table Spindle
    260 rpm

Technical Documents