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GCG300

Wafer Grinding Equipment by Komatsu (Dalian) Machine Tool Corp
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Product Specifications

Product Details

  • Part Number
    GCG300
  • Manufacturer
    Komatsu (Dalian) Machine Tool Corp

General Parameters

  • Overall Dimensions
    2370 x 3500 x 2500 mm
  • Spindle Rotation Speed
    600 to 3000 rpm
  • Wafer Size
    300 mm
  • Wheel Size
    120 mm
  • Work Table Spindle
    0 to 450 rpm

Technical Documents