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EAG-28SDANX (8")

Wafer Grinding Equipment by Engis Corporation (2 more products)
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Product Specifications

Product Details

  • Part Number
    EAG-28SDANX (8")
  • Manufacturer
    Engis Corporation

General Parameters

  • Automatic Measuring System
    Non Contact Gauge (in-Process)
  • Minimum Feed Speed
    0.1 µm/sec +
  • Net Weight
    5900 kg
  • Overall Dimensions
    2700 x 1800 x 2280 mm
  • Rated Output
    6 kW, 0.75 kW
  • Resolution
    0.1 µm
  • Spindle Rotation Speed
    6000 rpm
  • Wafer Size
    200 mm
  • Wheel Size
    203 mm
  • Work Table Spindle
    400 rpm

Technical Documents