Q2

Wafer Grinding Equipment by Logomatic GmbH

Note : Your request will be directed to Logomatic GmbH.

Product Specifications

Product Details

  • Part Number
    Q2
  • Manufacturer
    Logomatic GmbH

General Parameters

  • Net Weight
    4082 kg
  • Overall Dimensions
    1600 x 1600 x 1900 mm
  • Power Supply
    15 kW
  • Wafer Size
    6 Inches, 8 Inches

Technical Documents