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WID-300

Wafer Laser Marking Machine by E&R Engineering Corporation (3 more products)
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Product Specifications

Product Details

  • Part Number
    WID-300
  • Manufacturer
    E&R Engineering Corporation

General Parameters

  • Dot Depth
    0.1 to 3 µm (Si)
  • Dot Diameter
    25 to 80 µm
  • Loading Stations
    FOUP x 2
  • Marking Repeatability
    ±100 µm
  • Throughput
    150 wph
  • Wafer Size
    8 inches, 12 inches

Technical Documents