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TS300-SE

Wafer Probe System by MPI Corporation (24 more products)
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Product Specifications

Product Details

  • Part Number
    TS300-SE
  • Manufacturer
    MPI Corporation

General Parameters

  • Chuck Size
    325 x 325 mm
  • Mounting Movement
    50 x 50 mm
  • Net Weight
    600 kg
  • Overall Dimensions
    1190 x 1155 x 1600 mm
  • Planarity
    10 µm
  • Power Supply
    100-240 V AC 50/60 Hz
  • Resolution
    1 µm
  • Theta Movement
    5 Degree
  • Theta Stage Resolution
    7.5 x 10-3 gradient
  • Type
    Manual
  • Vacuum
    -0.3 bar
  • Wafer Size
    310 mm
  • Z Resolution
    1 µm
  • Z Travel Area
    5 mm

Technical Documents
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