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5832

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Product Specifications

Product Details

  • Part Number
    5832
  • Manufacturer
    F&S Bondtec Semiconductor GmbH

General Parameters

  • Bond Speed
    1 Wire in sec
  • Bonding Area
    200 x 150 mm
  • Bonding Method
    Wedge Bonder
  • Gold Wire Size
    17.5 to 75 µm
  • Loop Height Accuracy
    5 µm
  • Net Weight
    80 kg
  • Overall Dimensions
    920 x 710 x 650 mm
  • Placement Accuracy
    5 µm
  • Power Supply
    100-240 VAC, 1 Phase, 50/60 Hz, max 230 VA
  • Programmable Linear Z axis
    100 mm
  • Repeatability
    3 µm
  • Ribbon Size
    30 x 12.5 µm to 250 x 25 µm
  • Step Resolution
    1 µm
  • Temperature Control
    0 to 250 Degree C
  • Ultrasonic Frequency
    100 kHz
  • Wire Spool Size
    2 Inches

Technical Documents