Note : Your request will be directed to F&S Bondtec Semiconductor GmbH.

8650 Image

Product Specifications

Product Details

  • Part Number
    8650
  • Manufacturer
    F&S Bondtec Semiconductor GmbH

General Parameters

  • Bond Froce
    Up to 1800 cN
  • Bond Speed
    0.2 to 16 mm/sec
  • Bondheads
    90 mm
  • Bonding Method
    Wedge Bonder
  • Copper Wire Size
    100 to 300 µm
  • Motorized X and Y Travel
    700 mm, 480 mm
  • Motorized Z Travel
    100 mm
  • Net Weight
    600 kg
  • Overall Dimensions
    2000 x 1300 x 1000 mm
  • Power Supply
    230 VAC
  • Repeatability
    5 µm
  • Step Resolution
    1 µm
  • Ultrasonic Frequency
    60 kHz
  • Wire Spool Size
    4 Inches

Technical Documents