1. Home
  2. Semiconductor Equipment
  3. Assembly & Packaging Equipment
  4. Wire Bonders
  5. F&S Bondtec Semiconductor GmbH
  6. 5850HR

5850HR

Download Datasheet Request Information

Note : Your request will be directed to F&S Bondtec Semiconductor GmbH.

5850HR Image

Product Specifications

Product Details

  • Part Number
    5850HR
  • Manufacturer
    F&S Bondtec Semiconductor GmbH

General Parameters

  • Bond Froce
    Up to 1800 cN
  • Bond Speed
    1 Wire in sec
  • Bonding Area
    200 x 150 mm
  • Bonding Method
    Wedge Bonder
  • Copper Wire Size
    300 to 500 µm
  • Net Weight
    80 kg
  • Overall Dimensions
    920 x 710 x 650 mm
  • Power Supply
    100-240 VAC, 1 Phase, 50/60 Hz, max 230 VA
  • Programmable Linear Z axis
    100 mm
  • Ribbon Size
    Up to 2000 x 300 µm
  • Step Resolution
    1 µm
  • Temperature Control
    0 to 250 Degree C
  • Ultrasonic Frequency
    60 kHz
  • Wire Spool Size
    4 Inches

Technical Documents