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HB100

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Product Specifications

Product Details

  • Part Number
    HB100
  • Manufacturer
    TPT Wire Bonder GmbH & Co KG

General Parameters

  • Bond Froce
    10 to 200 cN
  • Bond Speed
    1 Wire in 3 sec
  • Bond Time
    0 to 5 sec
  • Bonding Method
    Ball Bonder, Wedge Bonder
  • Bonding Tool
    19 mm
  • Gold Wire Size
    17 to 75 µm
  • Maximum Component Width
    400 mm
  • Motorized X and Y Travel
    100 mm
  • Motorized Z Travel
    100 mm
  • Net Weight
    72 kg
  • Number of Heads
    1 Head
  • Overall Dimensions
    620 x 750 x 680 mm
  • Power Supply
    100-240V, +/-10%, 50/60 Hz, 10A max
  • Ribbon Size
    25 x 250 µm
  • Temperature Control
    Up to 200 Degree C
  • Ultrasonic Power
    0 to 10 W output
  • Ultrasonic Frequency
    63.3 kHz
  • Wire Feed Angle
    90 Degree
  • Wire Spool Size
    50.8 mm

Technical Documents