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HB30

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Product Specifications

Product Details

  • Part Number
    HB30
  • Manufacturer
    TPT Wire Bonder GmbH & Co KG

General Parameters

  • Bond Froce
    50 to 1800 cN
  • Bond Time
    0 to 10 sec
  • Bonding Method
    Wedge Bonder
  • Fine Table Motion
    15 mm
  • Gold Wire Size
    100 to 500 µm
  • Motorized X and Y Travel
    17 mm
  • Motorized Z Travel
    20 mm
  • Net Weight
    50 kg
  • Overall Dimensions
    680 x 640 x 490 mm
  • Power Supply
    100-240V, +/-10%, 50/60 Hz, 10A max
  • Ribbon Size
    300 x 2000 µm
  • Ultrasonic Power
    50 W output
  • Wire Feed Angle
    90 Degree

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