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ROCKET 100

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ROCKET 100 Image

Product Specifications

Product Details

  • Part Number
    ROCKET 100
  • Manufacturer
    Guangdong ADA Semiconductor Equipment

General Parameters

  • Bond Speed
    40 ms/wire
  • Bonding Method
    Wire Bonder, Ball Bonder
  • Leadframe Dimensions
    100 mm
  • Placement Accuracy
    ±2 µm
  • Note
    BPO - 40 µm

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