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ROCKET IC Image

Product Specifications

Product Details

  • Part Number
    ROCKET IC
  • Manufacturer
    Guangdong ADA Semiconductor Equipment

General Parameters

  • Bond Speed
    40 ms/wire
  • Bonding Method
    Wire Bonder, Ball Bonder
  • Leadframe Dimensions
    83 mm
  • Placement Accuracy
    ±2 µm

Technical Documents