Note : Your request will be directed to Guangzhou Minder-Hightech Co.,Ltd.

MDB-2575 Image

Product Specifications

Product Details

  • Part Number
    MDB-2575
  • Manufacturer
    Guangzhou Minder-Hightech Co.,Ltd

General Parameters

  • Bond Froce
    10 to 60 g
  • Bond Time
    5 to 200 ms
  • Bonding Area
    16 mm dia
  • Bonding Method
    Wire bonder
  • Copper Wire Size
    25 to 75 µm
  • Net Weight
    36 kg
  • Overall Dimensions
    600 x 560 x 390 mm
  • Power Supply
    220 VAC ± 10%, 50Hz
  • Ultrasonic Power
    0 to 3 W, 60 kHz

Technical Documents