Bondjet BJ653

Wire Bonder by Hesse GmbH (5 more products)

Note : Your request will be directed to Hesse GmbH.

Bondjet BJ653 Image

Product Specifications

Product Details

  • Part Number
    Bondjet BJ653
  • Manufacturer
    Hesse GmbH

General Parameters

  • Bondheads
    45 to 90 Degree
  • Bonding Method
    Wire Bonder
  • Copper Wire Size
    50 to 600 µm
  • Motorized X and Y Travel
    100 x 115 mm
  • Motorized Z Travel
    42 mm
  • Net Weight
    330 kg
  • Overall Dimensions
    700 x 1020 x 1409 mm
  • Power Supply
    100-240 VAC
  • Ribbon Size
    250 x 25 µm up to 2000 x 400 µm
  • Ultrasonic Frequency
    120 to 60 kHz
  • Wire Pitch
    40 µm

Technical Documents